ASIC Failure Analysis Engineer

Duration: Permanent

Payrate:  $130k- $150k

ASIC Failure Analysis Engineer(has Failure Analysis experience in 7nm (nanometer) semiconductor manufacturing technology or even more advanced like 5nm)

Bachelor’s in electrical/Electronic Engineering or related required. Master's Preferred

• 5+ years of experience in failure analysis field (preferably semiconductor).
• Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).
• Experience of FA techniques like Cross sectioning, X-ray, CSAM, TDR, FIB, SEM, and TEM is required.
• Fundamental knowledge of fault isolation technique , ATE, Scan/ATPG debug preferred.
• Good understanding of transistor functions and basic electronics.
• Knowledge of JEDEC IC Qualification tests and requirements is beneficial.
• Innovative and Creative with troubleshooting techniques.
• Enjoy hands-on work and working in a lab environment.

Experience Required:

• 5+ years of experience in failure analysis field (preferably semiconductor), Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging).

Roles & Responsibilities:

• Conduct Root cause analysis of reliability tests or field failures and propose corrective actions.
• Develop and implement standard processes for failure analysis.
• Coordinate all the logistics and instructions to direct the failure analysis process and carry out FA function in a systematic way.
• Document and report failure analysis results to management.
• Function as a technical resource for failure analysis questions.
• Develop and maintain relationships with vendors and suppliers.

SKILL:  Failure Analysis, Semiconductor Manufacturing, Cross-Sectioning, X-ray, CSAM (Acoustic Microscopy),TDR (Time-Domain Reflectometry),FIB (Focused Ion Beam),SEM (Scanning Electron Microscopy),TEM (Transmission Electron Microscopy),Fault Isolation, ATE (Automated Test Equipment),Scan/ATPG Debug