RF/mmWave Packaging Engineer

Duration : 12 Months

Pay range : $ 85 - 95 / HR on W2

Responsibilities:

• Design, simulate and validate advanced RF/mmWave packaging/module solutions. Liaise with OSAT vendors for manufacturing.
• Design, simulate and validate Integrated passive device (IPD). Liaise with foundry for tapeout.
• Design PCB schematic, layout and perform circuit and 3D EM simulation.
• RF lab debug, tuning, performance optimization and validation.

Minimum Qualification:

• 3+ years of experience in developing RF/mmWave packages and IPD design.
• At least BSEE or BSc in related engineering discipline
• In depth knowledge in electromagnetics, RF filters, PA and LNA design.
• Experience with foundry tapeout and working with OSAT vendors .
• Experience in RF schematics, layouts, and DFM.
• Experience with RF lab equipment and probe station for device characterization, debug, and component/system performance validation.
• Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
• Good communicator and team player.

Preferred Qualification:

• MS or PhD in EE with emphasis on advanced packaging or RFIC/mmWave design
• 5+ years of relevant industry experience
• Familiar with RF system design.
• Familiar with regulatory requirements (FCC, CE, etc.).