RF Module Engineer

Duration: 12 Months

Pay Rate: 75 - 110 / Hr. on W2

Own end-to-end RF module/SIP development for Client products from concept to mass production.
Responsible for module/SIP technology selection, part selection, vendor evaluation, contract development, and performing cost/technology/performance analysis.
Develop module architecture, schematics, and layouts, and work with vendors for DFM and manufacturing.
Perform simulation (RF circuit simulation, 3D EM simulation, and thermal simulation), factory bring up, lab bench debug, performance tuning and optimization, and validation of RF modules/SIPs.
Design, simulate and validate advanced RF packaging/module/SIP.
Collaborate closely with cross-functional teams and vendors to ensure RF performance is met at component, board, and system levels.
Evaluate new advanced packaging technology, including design and validation of prototypes.
Domestic/international travel to achieve program milestones.

Minimum Qualification:

3+ years of experience in developing RF modules/SIPs, preferable in wireless consumer electronics or similar industries.
At least BSEE or BSc in related engineering discipline
Experience with advanced packaging technologies and RF module/SIP design.
Experience in RF schematics, layouts, and DFM.
Work experience with RF lab equipment for device characterization, debug, and component/system performance validation.
Experience using circuit, EM, and thermal simulation tools such as Ansys HFSS, Keysight ADS/Momentum, Cadence Allegro, Cadence Virtuoso, Ansys Icepak, Flotherm.
Experience with developing RF test specifications and conducting RF lab testing with bench equipment (e.g., network analyzers, communication testers, spectrum analyzers, and oscilloscopes)
Good communicator and team player.

Preferred Qualification:

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