Technician - Computer Laboratory – I

Duration: 12+ Months (High Possibilities of Extension every quarter)

Job Description:

100% onsite role.

The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.

Minimum qualification:

• AA degree in science or engineering and 2-4 years’ experience in failure analysis, material analysis, process development or analytical tool development.
• Knowledge of packaging material property and behavior is beneficial.
• Candidate should also demonstrate good communication skills, work well with a team, deliver under pressure, and well organized.

Preferred skills:

Demonstrated skills in X-section/planar polishing, Optical microscopy imaging, and SEM imaging on printed circuit board are preferred